Principal Engineer, CMP Advanced NAND

About the role

Micron is hiring a Principal Engineer for its CMP Advanced NAND team at Fab 10N/X. As a Staff/Principal Engineer, you will join a next-generation NAND R&D dry etch team and work closely with process integration and other process areas such as wet etch, CVD, diffusion, metals, lithography and dry etch. You will own the process roadmap to meet program and yield goals.

Key responsibilities

• Develop and optimize chemical mechanical planarization (CMP) procedures to improve product quality and reliability for next-generation memory parts.
• Focus on process margins needed to meet the mature yield goal for 3D NAND parts.
• Carry out fundamental research, consumables development and hardware evaluation, and test processes for novel applications.
• Run experiments to widen process margins and evaluate the manufacturability of next-node solutions.
• Work with vendors to develop processes that meet integration requirements for current and next-generation 3D NAND nodes.
• Incorporate proven manufacturing methods into early development of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Provide a strategic roadmap for N+, N++ and future NAND nodes.
• Act as a technical expert, leading complex multi-functional projects and advising management on major technical issues.
• Mentor new hires and less experienced colleagues on CMP fundamentals, process development and Micron systems.
• Collaborate with procurement and operations teams, and contribute to quality, yield, cost and productivity improvement meetings.

Required profile

• MSc or PhD with 5-10 years of experience, or Bachelor's degree with 7-12 years, in the semiconductor industry with a CMP background in 300mm wafer fabrication.
• Hands-on experience operating CMP equipment such as AMAT LKP, EBARA-300X and next-generation CMP tools, optical metrology, profilometry, polishing slurries, conditioners and pads.
• Experience in dielectric/metal CMP process development on 3D NAND or other memory technology.
• Strong oral and written communication, collaboration and self-driven project management skills.
• Preferred: understanding of planar and vertical NAND process flows, and interest in data science, modelling and AI adoption.