Principal Engineer - CMP Process Development (3D NAND)

About the role

Micron is hiring a Principal Engineer for its CMP process development team, supporting advanced 3D NAND and future technology nodes. The role leads process characterization, margin improvement, integration and transfer readiness, and drives cross-functional alignment with global development, manufacturing, equipment and supplier teams. It works at Fab10N and resolves complex process, yield, defectivity and manufacturability challenges.

Key responsibilities

• Lead CMP process characterization and advanced process development for 3D NAND and future nodes, defining strategies that improve margin, robustness, yield and performance.
• Run complex experiments and data analysis to validate process windows, technology scaling readiness and integration requirements.
• Drive transfer of CMP processes to high-volume manufacturing at Fab10N and support ramp readiness and continuous improvement.
• Collaborate with process development, process integration, manufacturing, equipment teams and suppliers, and evaluate consumables, equipment and hardware.
• Resolve process, yield and integration issues using root-cause analysis and data-driven decisions.
• Develop process monitoring and control methods, simplify processes and mentor junior engineers.

Required profile

• PhD with at least 5 years, Master's with at least 7 years, or Bachelor's with at least 10 years of relevant experience in electrical engineering, materials science, chemical engineering, physics or a related field.
• Demonstrated CMP process development experience for advanced semiconductor or memory technologies, including leadership of complex technical projects.
• Hands-on experience with leading-edge CMP polishing equipment such as EBARA WS or Applied Materials platforms.
• Preferred: experience transferring CMP processes to high-volume manufacturing and a record of patents, papers or technical standards.

Required skills

• Deep CMP expertise: dielectric and metal polishing mechanisms, slurry, pad, conditioning, equipment operation and process optimization.
• Understanding of NAND or memory process integration and film deposition/CMP interactions.
• Proficiency in Design of Experiments, root-cause analysis, statistical data interpretation and tools such as Y3.
• Ability to develop process monitoring and control strategies and to evaluate CMP consumables and equipment.