Principal Engineer, NAND Advanced Thin Films Process Development

About the role

Micron Technology is hiring a Principal Engineer for its Process Development - Advanced Thin Film team. The role defines technical direction and leads the implementation of structural and electrical film processes for NAND memory, working across teams to integrate new processes into manufacturing and support technology roadmaps.

Key responsibilities

• Define and implement the technical strategy for structural and electrical film process development, aligned with business and technology objectives.
• Lead multi-functional teams in developing, integrating and scaling thin film processes for advanced NAND structures and devices.
• Oversee end-to-end process module development, focusing on manufacturability, scalability and integration readiness.
• Solve complex technical challenges, including root cause analysis and mitigation of process and device failures.
• Mentor senior engineers and influence technical direction across the organization.
• Represent the function in technical forums, industry consortia, conferences and joint development projects.
• Drive technology transfer and ramp-up from R&D to high-volume manufacturing.
• Evaluate emerging trends, risks and opportunities, and recommend future investments.
• Lead cost reduction, yield improvement and reliability enhancement programs.

Required profile

• PhD or equivalent degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering or a related field.
• 5-10 years of experience in thin film research and development for NAND processes, including CVD and diffusion thin films.
• Experience leading cross-disciplinary teams with integration, device, reliability and manufacturing engineering groups.

Required skills

• Thin film deposition: Atomic Layer Deposition and Chemical Vapor Deposition, process design, optimization and integration for high-density NAND.
• Advanced characterization: XRR, ellipsometry, SEM, TEM, SIMS, XPS, and electrical evaluation (leakage, impedance, capacitance, breakdown).
• Process development with plasma and thermal methods for dielectric, low-k, high-k and carbon-based films, and failure analysis.
• Statistical process control (SPC), design of experiments (DOE) and data analytics.
• Benchmarking, competitive analysis and technology roadmapping.
• Regulatory compliance, intellectual property management and technical documentation in semiconductor manufacturing.