Principal Engineer – NAND Dry Etch Process Pathfinding

About the role

Micron's Advanced NAND Process Pathfinding team develops the next generation of memory technology. As a Principal Engineer – Dry Etch, you will join an innovative research and development dry etch team and work directly with process integration and other process domains such as wet etch, CVD, diffusion, metals, lithography and CMP. You will manage brand-new, high-performance dry etch chambers and lead the process roadmap to meet program and yield targets.

Key responsibilities

• Explore advanced dry etch methods to meet structural, electrical, yield and integration requirements across the NAND technology roadmap.
• Develop new plasma chemistries, process technologies and equipment capabilities for future technology nodes.
• Apply data analytics, AI/ML tools and statistical methods to accelerate process learning and improve etch performance.
• Drive process pathfinding through automation, predictive modeling and data-driven decisions.
• Work with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP and Device teams on technology development and manufacturability.
• Use AI-enabled engineering tools, advanced analytics and digital workflows to speed up process development and raise R&D productivity.

Required profile

• Practical experience with ICP and/or CCP plasma etch in semiconductor process development.
• Experience developing and refining dry etch processes for advanced semiconductor technologies.
• Familiarity with statistical analysis, data analytics and process optimization.
• Strong cooperation with multidisciplinary engineering teams.
• Preferred: PhD/MS with 7-10 years of relevant experience, experience with high aspect ratio etch, selective etch and pattern transfer, and experience mentoring engineers or leading technical projects.

Required skills

• Plasma physics, plasma-surface interactions, etch chemistry and profile control.
• Dry etch equipment fundamentals.
• Statistical analysis and data analytics.