Principal Engineer, NAND Process Integration

About the role

Micron Semiconductor Operation Pte Ltd is hiring a Principal Engineer for its NAND Module Process Integration team in the Singapore R&D department. You will design, develop, integrate and implement process solutions that improve the yield and quality of next-generation 3D NAND products, with competitive cost and performance within the required timeline.

Key responsibilities

• Lead one or more process modules for the development and operation of a 3D NAND semiconductor integrated circuit, defining structural specifications and process requirements
• Set a clear direction and vision for the module, with a defined continual improvement plan
• Proactively identify and resolve structure, electrical and reliability issues early, using a model-based approach
• Optimize structural development, electrical performance, parametric verification and process control and manufacturability
• Analyze materials and work with process groups to select and introduce new materials from research into production
• Design and run device and process experiments, analyze the data and draw logical conclusions
• Lead the module development team, set goals and metrics, and coordinate activities such as reticle tapeouts, flow changes and lot management
• Drive innovation and generate patents, and support technology transfer from R&D to high-volume manufacturing
• Communicate key information through presentations and group discussions, and use AI tools responsibly to improve efficiency and quality

Required profile

• PhD with at least 5 years, or Master's with at least 7 years, or Bachelor's with at least 10 years in Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering, Physics or a related field, with semiconductor industry experience
• Experience in R&D and technology transfer within the semiconductor industry
• In-depth knowledge of non-volatile memories (NAND) and the NAND process flow, and understanding of common yield and reliability issues
• Ability to understand end-to-end PI modules on new NAND technologies and their structural and electrical fail mechanisms
• Self-motivated, able to work in a demanding and dynamic environment

Required skills

• Data analysis, problem-solving and process integration optimization
• Excellent communication and collaboration in multi-functional teams
• Desirable: scripting, programming, engineering, business intelligence and analytics software such as Python, SolidWorks, Tableau and Power BI