Principal Engineer, PD SG Thin Film (CVD/Diffusion)

About the role

Micron is hiring a Principal Engineer for its Process Development (PD) team working on structural and electrical thin-film processes for advanced NAND structures and devices. The role leads multi-functional teams in developing, integrating and scaling thin-film processes, driving technology transfer from R&D to high-volume manufacturing and improving yield, reliability and cost.

Key responsibilities

• Define and implement the technical strategy for structural and electrical film process development aligned to business and technology objectives.
• Lead multi-functional teams to develop, integrate and scale thin-film processes for advanced NAND structures and devices.
• Oversee end-to-end development of process modules, focusing on manufacturability, scalability and integration readiness.
• Resolve complex technical challenges with significant business impact, such as root cause analysis and mitigation of process and device failures.
• Drive technology transfer and ramp-up activities to move from R&D to high-volume manufacturing.
• Lead cost reduction, yield improvement and reliability enhancement programs through innovative process and material utilization.
• Mentor senior engineers, represent the function in technical forums and benchmark against industry standards.
• Identify emerging trends, risks and opportunities and recommend future investments and critical initiatives.
• Use AI-assisted tools responsibly to improve efficiency, quality and effectiveness, and share AI-enabled improvements within your scope of work.

Required profile

• PhD with at least 5 years, or Master's degree with at least 7 years, or Bachelor's degree with at least 10 years of relevant experience.
• Experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field.
• Demonstrated experience in thin-film R&D and process development for NAND, including CVD and diffusion thin films.
• Strong technical leadership through influence, cross-functional and cross-site collaboration, and mentorship.
• Executive-ready technical communication.

Required skills

• Mastery of thin-film deposition (ALD/CVD) for high-density NAND, including process design, optimization and integration.
• Advanced characterization techniques such as XRR, ellipsometry, SEM, TEM, SIMS and XPS, and electrical evaluation methods (leakage, impedance, capacitance, breakdown).
• SPC, DOE and data analytics for optimization and troubleshooting.
• Ability to drive novel chemistries, materials and hardware solutions (chamber design, plasma source optimization, gas delivery).
• Baseline digital fluency and AI literacy to use AI tools responsibly for research, analysis and problem solving.