Principal PCB Layout Engineer (Master Level)

About the role

Join LITE‑ON’s Cloud Infrastructure Platform and Solutions (CIPS) Research team in Singapore as a Principal / Master PCB Layout Engineer. You will lead the development of advanced PCBA layouts for high‑power, high‑speed applications supporting the rapidly evolving data‑center sector.

Key responsibilities

• Lead PCB layout activities from concept and lab demos through to production‑intent designs.
• Define board stack‑up, component placement, routing and optimisation for high‑current and high‑speed signals.
• Develop design processes for high‑voltage/power boards, ensuring compliance and safety.
• Drive best practices in signal/power integrity, EMI/EMC, thermal management, DFM and DFT.
• Collaborate with electrical, mechanical and thermal engineers to optimise performance and integrate cooling solutions.
• Conduct design reviews and provide technical leadership across multiple projects.
• Interface with PCB fabricators and assembly partners to deliver cost‑effective prototypes.
• Research emerging PCBA technologies and continuously improve layout methodologies.

Required profile

• Bachelor’s degree in Electrical/Electronic Engineering or related field.
• Minimum 6 years of PCB layout experience, including complex multilayer designs.
• Proven track record leading layout reviews and delivering high‑voltage, high‑current designs.
• Strong analytical, problem‑solving and communication skills.

Required skills

• PCB design tools: OrCad, PADS, Altium Designer, Cadence Allegro.
• High‑current power routing, creepage & clearance, high‑voltage design.
• Differential pair routing, controlled impedance, high‑speed interfaces.
• EMI/EMC compliance, thermal optimisation, design for manufacture & test.
• Power electronics (AC/DC, DC/DC) and controller experience (FPGAs, DSPs, MCUs).
• Knowledge of power modules, GaN, SiC, liquid‑cooled electronics, HDI technologies.