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Product Development Engineering Engineer - Key Equipment Group

micron · Msb

New
Junior 🇬🇧 English
Wafer bumping Advanced packaging Equipment automation FDC APC AMHS

Job description

About the role

Micron is looking for a Product Development Engineering (PDE) engineer in its Key Equipment Group (KEG) to support the development of highly automated and computerized equipment for packaging technology. The role covers identifying, selecting and evaluating new equipment and technology, qualifying new equipment platforms and handing them over to production, and maintaining equipment maturity records.

Key responsibilities

  • Evaluate and qualify new equipment platforms, plan capital requests, create purchasing specifications and set qualification criteria and handover procedures.
  • Define equipment design and capability requirements aligned to the Process and Packaging Roadmap, and work with suppliers to develop new capabilities.
  • Benchmark equipment and assist senior engineers in equipment selection.
  • Maintain the Equipment Maturity Index (EMI) and the Tool of Records (TOR) matrix of equipment capability and constraints, and keep it updated with input from sites.
  • Enable equipment control systems such as FDC, E3, APC, IOT, ECM and R2R, and support automation solutions including AMHS readiness.
  • Manage supplier engagement through executive, technical and quarterly business reviews and continuous improvement projects.
  • Train site representatives, gather data for low-volume production and feed back improvements to high-volume manufacturing.

Required profile

  • PhD, Master's or bachelor's degree in Electrical/Electronic, Material, Mechanical Engineering, Physics or Applied Physics, or equivalent.
  • 0-2 years of experience in the semiconductor industry or a related manufacturing environment; internship or semiconductor experience is a plus.
  • Basic knowledge of semiconductor assembly, wafer bumping packaging and advanced packaging; understanding of equipment automation is a plus.
  • Strong communication and presentation skills in English, project management skills, and ability to work with cross-functional teams and external vendors.
  • Seasonal travel may be required.

Required skills

  • Hardware and software engineering assignments as required.
  • Use of AI-assisted tools for research, analysis and problem solving.
  • Knowledge of the semiconductor industry and Micron is preferred.

Questions fréquentes

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Source : ats:workday

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Published 1 day ago

Expires 1 month from now

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micron

Msb