R&D Engineer – Packaging Process

About the role

We are looking for an experienced R&D Engineer to design and implement packaging processes for new isolation products. The role involves close collaboration with IC designers, product engineers, manufacturing teams and contract manufacturers to bring innovative semiconductor packages to market.

Key responsibilities

• Design and implement packaging processes for isolation products, including die‑attach, wire‑bond, encapsulation molding, and package trim/forming.
• Evaluate material reliability, properties and techniques; explore new process methodologies.
• Perform Design of Experiments (DOE) and optimise newly developed processes.
• Lead R&D programs with cross‑functional teams to validate new devices.
• Conduct process yield analysis and investigate failures of new devices.
• Plan engineering programmes to achieve cost targets and improve manufacturing yield, quality and reliability.

Required profile

• Strong mechanical engineering background with semiconductor packaging experience.
• Proven analytical, critical‑thinking and problem‑solving abilities.
• Familiarity with mechanical lead‑frame design rules and semiconductor physical failure analysis.
• Experience with high‑voltage isolation requirements and related materials.
• Track record of leading NPI projects from verification to high‑volume launch is a plus.

Required skills

• Die Attach
• Wire Bond
• Encapsulation Molding
• Package Trim/Forming
• Vision Inspection Tools
• Mechanical Lead‑Frame Design Rules/Tools
• Semiconductor Physical Failure Analysis
• Design of Experiments (DOE)
• Process Optimization
• Yield Analysis
• Failure Investigation