Senior Engineer, Process Development, Wet Etch (NTI)

About the role

Micron is hiring a Senior Engineer for its Process Development, Wet Etch team in Singapore. The role focuses on developing and optimizing unit processes for advanced NAND parts, improving process margins and supporting technology decisions for upcoming nodes. It involves fundamental research, hardware evaluation, testing and IP generation, and requires close collaboration with local and global partners.

Key responsibilities

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part types.
• Quantify the benefits of new process and equipment solutions to enable early experimentation and adoption for process margin improvement.
• Prioritize key technology issues for the Singapore-based manufacturing Wet Etch team and integrate and troubleshoot processes in cross-functional teams.
• Work with Boise TD Wet Etch peers on technology choices for upcoming nodes and turn device needs into clear process requirements.
• Run experiments to widen process margins and test manufacturability of next-node solutions, including fundamental research, hardware evaluation and testing of novel applications.
• Identify process simplification opportunities and incorporate best-known manufacturing methods into early development of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies, and lead or contribute to quality, yield, cost and productivity improvement meetings.
• Advise management on major technical issues, lead innovation projects through patents and technical papers, and adhere strictly to Micron's IP protection policy.

Required profile

• Masters or PhD in Chemistry, Materials Science or Chemical/Microelectronic Engineering.
• 2-3 years of semiconductor industry experience preferred.
• Proven ability to collaborate with local and overseas teams and excellent oral and written communication skills.
• Self-motivated, adaptable and able to handle extended hours and multiple projects in a demanding environment.

Required skills

• Deep understanding of chemistry, chemical kinetics, thermodynamics and mass transport.
• Basic understanding of films and interface engineering, and techniques such as SIMS, XPS, EDX, SEM/TEM and FTIR.
• Understanding of wet etch integration and structural constraints, and of planar and vertical NAND memory process flows.
• Working knowledge of data analysis systems (e.g. Y3) and Design of Experiments (DoE).