Senior Member of Technical Staff - Dry Etch (NAND)

About the role

Micron is hiring a Senior Member of Technical Staff (SMTS) Dry Etch Engineer for its Next Generation NAND research and development team. This senior individual contributor defines, develops and transfers advanced dry etch processes for Micron NAND technologies, working directly with process integration and areas such as Wet Etch, CVD, Diffusion, Metals, Lithography and CMP. The role owns the process roadmap to meet program and yield goals.

Key responsibilities

• Own key NAND dry etch process levels and modules, turning technology challenges into roadmaps for N, N+1 and N+2 nodes
• Serve as the primary Dry Etch representative in program and module meetings
• Drive multi-functional execution across Technology Development, Process Integration and Manufacturing
• Develop dry etch processes meeting structural and electrical specifications for advanced NAND devices
• Lead first-of-a-kind dry etch development, including recipe architecture, EPD strategy, control plans and integration alignment
• Set up tool redundancy, run-to-run controls and E3 monitors to improve robustness and manufacturability
• Meet process maturity, CSPEC, SPC and qualification criteria and timelines independently
• Update program stakeholders on technical status and risks, and collaborate with equipment and supplier teams on hardware roadmaps
• Use model-based and data-driven methods to solve yield, defectivity and integration issues
• Mentor MTS engineers, interns and early-career staff, and contribute to technical leadership and development activities

Required profile

• 12-15 years of dry etch process development in R&D (NAND, DRAM or Logic) transferring to manufacturing, of which 7-10 years in memory products such as NAND and DRAM
• PhD with at least 12 years of relevant dry etch experience, or BS/MS with at least 15 years
• Demonstrated aptitude for R&D, leadership in problem solving and project management
• Proven ability to drive technical execution and influence multi-functional teams

Required skills

• In-depth knowledge of plasma physics, plasma chemistry, transport or surface phenomena
• Understanding of plasma dry etch reactors (RF sources, chemistries)
• Statistical process control and analysis
• Solving scalability problems of deep high aspect ratio silicon/dielectric etches, including tailored pulsing schemes
• MS Office and SAS software such as JMP
• AI development and coding capability preferred