Senior Member of Technical Staff, Process Development - Cell Film

About the role

Micron is looking for a Senior Member of Technical Staff (SMTS) in process development for its cell film business. The role acts as a technical authority in 3D NAND cell film development, sets strategic direction and leads multi-functional initiatives, influences technical standards and drives process improvements. It involves global projects and mentoring engineers.

Key responsibilities

• Define technical strategy and lead multi-functional projects in cell film development
• Architect solutions and promote innovative technologies across teams
• Influence technical standards and drive process improvements
• Lead advanced process development, fix and integration
• Mentor engineers and foster technical growth, contributing to Micron's mentoring programs and building SME pipelines for Cell Films
• Integrate unit processes into full cell packages and validate device/process linkages via wafer-level electricals
• Solve complex problems across process/hardware/device interactions using root cause analysis, FMEA, SPC and corrective actions
• Use characterization tools (SIMS, XPS, TEM, EDX/EELS, electrical stress testing, TDS) to correlate process parameters to device performance and author correlation models
• Lead multi-functional teams and vendor engagements, and publish internal papers and BKMs

Required profile

• PhD or equivalent in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering or a related field
• 15 to 20 years of experience in thin film research and development for NAND processes, specifically diffusion, CVD and cell films
• Demonstrated leadership in multi-functional development and vendor collaboration
• Proven track record in architecting solutions, process-device correlation and mentoring engineers

Required skills

• Thin film processing: ALD, CVD nitride/oxide systems, multi-layer ONO stack design, barrier and protection layers, batch furnace/RTP integration
• Hardware optimization: precursor delivery, temperature control, chamber matching, batch vs single wafer trade-offs, metrology hooks
• Process-device interaction understanding, reliability modeling and 3D NAND scaling
• Advanced characterization: SIMS, XPS, TEM, electrical stress testing