Senior Member of Technical Staff - Process Development, Cell Film, NAND

About the role

Micron is hiring a Senior Member of Technical Staff (SMTS) for its Fab 10N/X site, focused on 3D NAND cell film process development. The SMTS acts as a technical authority, defining technical strategy, leading multi-functional initiatives, influencing technical standards and mentoring engineers.

Key responsibilities

• Define technical strategy, architect solutions and influence technical standards to drive process improvements
• Lead advanced process development, fix and integration, and integrate unit processes into full cell packages validated by wafer-level electricals
• Solve complex problems across process/hardware/device interactions (RCA, FMEA, SPC, corrective actions) without yield trade-offs
• Use advanced characterization (SIMS, XPS, TEM, EDX/EELS, electrical stress testing, TDS) to correlate process parameters to device performance and build reliability and scaling models
• Lead vendor engagements, publish internal papers and BKMs, and present to senior leadership
• Mentor engineers, build the SME pipeline and uphold Micron's technical leadership expectations

Required profile

• PhD with at least 12 years, or Master's degree with at least 15 years, of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field
• Experience in thin film R&D for NAND, specifically diffusion, CVD and cell film technologies
• Proven track record of architecting technical solutions and process-device correlation, with publications, patents and a strong record of technical contributions

Required skills

• Deep expertise in ALD/CVD thin film processing, including nitride/oxide systems, inhibitor chemistries, multi-layer ONO stacks and barrier/protection layers
• Hands-on leadership in cell film hardware and equipment optimization (precursor delivery, temperature control, chamber matching, batch vs single-wafer trade-offs, metrology hook integration)
• Process-device interactions, reliability modeling and 3D NAND scaling
• Advanced characterization techniques (SIMS, XPS, TEM, EDX/EELS, electrical stress testing)
• Structured problem-solving, clear communication and cross-functional collaboration