Senior Product Quality and Reliability Assurance Engineer (HBM)

About the role

Micron is hiring a Senior/Staff Product Quality and Reliability Assurance Engineer (PQRA) at its Fab 10A site. The engineer supports reliability qualification and quality monitoring of High Bandwidth Memory (HBM) products, helps develop product reliability methodologies and responds to product deviations. The role works with multi-functional engineering teams, performs risk assessments and supports manufacturing teams on reliability issues.

Key responsibilities

• Conduct new product qualifications: define HBM qualification requirements, comprehend failures and failure rates, perform risk assessments at each decision point, review qualification data and sign off that requirements are met, and issue internal product release notifications.
• Develop product reliability methodology, monitors, metrics and specifications, and set reliability targets and standards with technology development and product engineering teams.
• Learn new wafer fab and packaging technologies to identify and mitigate reliability issues, and develop and improve reliability tests for new HBM failure mechanisms.
• Drive specification improvements for existing products and coordinate quality metrics, including driving customer DPM to BIC.
• Establish quality requirements, review ongoing quality metrics, assess deviations and root-cause findings, and communicate violations against release/acceptance criteria.
• Support customer support teams and the RMA team with analysis of returned material, investigate manufacturing history and customer failure signatures, and assist with corrective actions at the manufacturing level.
• Develop Reliability Process Monitor (RPM) plans, integrate AI-assisted tools into daily work, and contribute to continuous improvement.

Required profile

• Bachelor's degree in Electrical, Electronics or Computer Engineering; a Master's degree is desired.
• 5+ years of experience in the semiconductor field.
• Knowledge of DRAM operation, fabrication processes and semiconductor device physics.
• Familiarity with advanced packaging, wafer testing, component testing and module testing concepts and flows.
• Strong troubleshooting, organizational and attention-to-detail skills, and good written and oral communication.
• Ability to work independently or in a group; engineering experience in Product Engineering, Product Quality and Reliability, Process Integration or Product Yield Enhancement is preferred.

Required skills

• Statistical tools such as JMP.
• Preferred: Unix, DFII/Cadence, ATE (auto test equipment).
• Preferred: Perl, C++, Python, HTML, CGI or Java.