Senior Research Fellow – Semiconductor Advanced Packaging

About the role

The School of Electrical and Electronic Engineering at Nanyang Technological University seeks a Senior Research Fellow to lead the development of low‑temperature Cu/dielectric hybrid bonding for fine‑pitch, high‑density interconnects. The role focuses on creating a manufacturable 3‑D integration flow that operates at ≤200 °C and delivers reliable dielectric sealing.

Key responsibilities

• Develop and execute a Cu–Cu hybrid bonding process for fine‑pitch 3‑D integration.
• Optimize process windows (pressure, temperature, anneal, surface activation) to reduce contact resistance and voids while adhering to cleanroom best practices.
• Characterize materials and interfaces using optical profilometry, SEM/TEM, surface chemistry techniques, and electrical IV measurements, translating findings into process improvements.
• Validate reliability and scalability through thermal cycling, high‑temperature storage, and electrical stress tests on prototype stacks such as interposers or test chips.
• Produce technical reports and presentations, maintain rigorous documentation, version control, and safety compliance, and coordinate with industry partners and tool vendors.

Required profile

• PhD in Materials Science, Microelectronics, Electrical & Electronic Engineering, or a related discipline.
• Hands‑on experience in semiconductor cleanroom process development (Cu interconnects, wafer‑level or hybrid bonding, lithography, etching, CMP, plasma, annealing).
• Proficiency in materials and interface characterization techniques.
• Strong analytical mindset with experience in reliability testing and root‑cause analysis.
• Excellent documentation and communication skills in English.

Required skills

• Cu–Cu hybrid bonding
• Cleanroom semiconductor process development (lithography, etch, CMP, plasma, anneal)
• Optical profilometry
• Scanning Electron Microscopy (SEM) / Transmission Electron Microscopy (TEM)
• X‑ray Photoelectron Spectroscopy (XPS) / Atomic Force Microscopy (AFM)
• Electrical probing and IV measurement
• Design of Experiments and statistical analysis (Python, Matlab)