SMTS Integration Engineer - Advanced Packaging (2.5D and 3D Heterogeneous Integration)

About the role

GlobalFoundries is seeking an experienced SMTS Integration Engineer to lead its Advanced Packaging Program, focusing on 2.5D and 3D heterogeneous integration technologies. The role combines technical expertise in advanced semiconductor packaging with engineering integration leadership.

Key responsibilities

• Lead integration activities, overseeing the integration of 2.5D and 3D technologies and coordinating design, process and manufacturing teams
• Provide technical guidance on 2.5D and 3D packaging processes, materials and equipment, and stay current with industry trends
• Develop and maintain project plans, timelines and budgets, and coordinate with cross-functional teams to meet milestones
• Drive process development and optimization, including interposer design, through-silicon vias (TSVs), die stacking and thermal management
• Implement and monitor quality control measures for product reliability and performance
• Collaborate with R&D, design and manufacturing teams to bring new packaging solutions into production
• Maintain technical documentation such as process flow diagrams, work instructions and validation reports
• Solve technical challenges, implement corrective actions and continuous improvement initiatives
• Mentor junior engineers and technicians
• Ensure compliance with industry standards and regulatory requirements

Required profile

• Bachelor's or master's degree in electrical engineering, Materials Science, Mechanical Engineering or a related field
• Minimum of 10 years of experience in semiconductor packaging, including at least 5 years in a leadership role in 2.5D and 3D heterogeneous integration
• Proven track record managing complex projects with cross-functional teams
• Strong analytical and problem-solving skills, excellent communication skills, and leadership and mentorship abilities

Required skills

• In-depth knowledge of 2.5D and 3D heterogeneous integration, including interposer design, TSVs, die stacking and system-in-package (SiP)
• Ability to troubleshoot technical issues and adapt to changing priorities under pressure