Staff/Principal Engineer - CMP Advanced NAND

About the role

Micron is hiring a Staff/Principal Engineer for its next-generation NAND research and development dry etch team. The engineer develops and optimizes chemical mechanical planarization (CMP) procedures to improve product quality and reliability for Micron's memory parts, working closely with process integration and areas such as wet etch, CVD, diffusion, metals, lithography and dry etch. The role owns the process roadmap to meet program and yield goals.

Key responsibilities

• Develop and optimize CMP procedures, focusing on process margins needed to meet mature yield goals for 3D NAND parts
• Carry out fundamental research, consumables development and hardware evaluation, and test processes for novel applications
• Run experiments to widen process margins and evaluate manufacturability of next-node solutions
• Work with vendors to develop processes that meet integration requirements for current and next-generation 3D NAND nodes
• Incorporate proven manufacturing methods into early development of upcoming nodes
• Design and implement advanced process monitoring and control methodologies
• Provide a strategic roadmap for N+, N++ and future NAND nodes
• Act as a technical expert, leading complex multi-functional projects and advising management on major technical issues
• Mentor new hires and less experienced colleagues, and engage with procurement and operations teams
• Lead or drive teams on quality, process/yield, cost and productivity improvement meetings
• Use AI-assisted tools to improve efficiency and share AI-enabled improvements

Required profile

• PhD with at least 5 years, or Master's with at least 7 years, or Bachelor's with at least 10 years of relevant experience
• Demonstrated expertise in semiconductors and hands-on experience with CMP on 300 mm wafers
• Experience developing CMP processes for dielectrics or metals on 3D NAND or other memory technology
• Strong interest in data science, modelling and adoption of AI to optimize workflows
• Excellent oral and written communication, collaboration and self-driven project management skills

Required skills

• CMP equipment operation such as AMAT LKP, EBARA-300X and next-generation CMP equipment
• Optical metrology, profilometry, polishing slurries, conditioners and polishing pads
• Understanding of integration and structural constraints of film deposition and upstream/downstream processes
• Knowledge of the process flow for planar and vertical NAND memory