2.5D/3D Assembly Engineer – Semiconductor Packaging

About the role

A highly skilled 2.5D / 3D Assembly Engineer is sought to support the development and implementation of advanced semiconductor packaging and integration technologies. The role covers wafer-level packaging, 2.5D/3D assembly processes, package design optimization, reliability engineering and advanced technology development, with an onsite work arrangement.

Key responsibilities

• Lead the development and optimization of advanced semiconductor packaging and assembly technologies, including 2.5D and 3D integration.
• Support package design, assembly process development, and DFM and DFT initiatives.
• Perform thermo-mechanical, electrical and reliability analysis using simulation and modeling tools.
• Investigate and resolve packaging, assembly and reliability challenges across operating environments.
• Collaborate with cross-functional teams, suppliers and manufacturing partners on technology development and process improvements.
• Conduct failure analysis, root-cause investigations and reliability assessments.
• Support the introduction of new materials, packaging technologies and assembly methodologies.
• Contribute to technical documentation, design guidelines and continuous improvement.

Required profile

• Master's or PhD in Mechanical Engineering, Materials Science, Physics, Semiconductor Packaging, Micro/Nanofabrication or a related discipline.
• Strong hands-on experience in semiconductor assembly, packaging or advanced integration technologies.
• Experience with wafer-level packaging, 2.5D/3D packaging and advanced assembly processes.
• Knowledge of package structures, materials, manufacturing processes and reliability considerations.

Required skills

• Familiarity with CAD tools and thermo-mechanical simulation; experience with FEM for thermal, mechanical or electrical analysis.
• Understanding of assembly-related failure mechanisms and reliability engineering.
• Preferred: PDK development, TSV and thin-film knowledge, cryogenic testing, high-voltage packaging qualification, and a background in process or manufacturing engineering.