Advanced Packaging Die-Level Technology Engineer (APTD CEM)

About the role

Micron, a global leader in memory and storage solutions, is hiring an Engineer for its APTD CEM team in Fab 10A, focused on advanced packaging die-level technology. The role develops and optimizes assembly processes such as wafer-level packaging and die stacking (Chip on Wafer, Chip to Wafer), improves yield and quality, and supports the transition from new product development to high-volume manufacturing.

Key responsibilities

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking, focusing on product quality, yield, cost and productivity.
• Establish and improve process management projects to meet technology node requirements.
• Evaluate and promote new equipment and materials, set up process parameters for semiconductor equipment, and plan for new ones.
• Ensure process defense coverage through process, measurement, inspection and testing, and use data analysis to set advanced controls and find improvement opportunities.
• Work with internal and external stakeholders, including Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering and Global Quality, to align technology development with business objectives.
• Support the transition from new product development, qualification and small-volume production to high-volume production, and provide Process of Record (POR) and Model of Record (MOR) documentation for product transfer to high-volume manufacturing facilities.

Required profile

• Bachelor's or advanced degree in Engineering or Science.
• Strong analytical, logical and critical thinking skills, and effective communication across all levels.
• Growth mindset and interest in the semiconductor industry and Micron.
• Internship or semiconductor industry experience is a plus; demonstrated leadership and a track record of impact are highly desirable.

Required skills

• Preferred: Python, R and SQL for statistical analysis, process modeling and data analytics.
• Preferred: Visual Basic for automation and tool integration.