Advanced Packaging Integration Engineer (APTD CEM)

About the role

Micron, a global leader in memory and storage solutions, is hiring an Advanced Packaging Integration Engineer (APTD CEM) at its Fab 10A site. The role develops and enables advanced package technology for post-fab wafer finish and assembly processes, working with process and product engineering teams to improve yield, quality and productivity.

Key responsibilities

• Develop advanced package technology for post-fab wafer finish and assembly processes, improving product quality, yield, cost and productivity
• Improve yields through silicon package integration innovation, beyond layout/design or process margin improvements, and work with Probe, Yield Analysis, Test and Product Engineering teams
• Ensure defense coverage through process, measurement, inspection and testing, and establish correlations between defense mechanisms
• Build and execute technology development strategies with internal and external stakeholders, including PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering and Global Quality
• Support the transition from new product development and qualification to high volume production, and provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to high volume manufacturing facilities

Required profile

• Bachelor's or advanced degree in Engineering or Science
• Strong analytical, logical and critical thinking skills
• Effective communicator who collaborates across all levels, with a growth mindset
• Experience in the semiconductor industry is a plus; internship or experience is a plus
• Demonstrated leadership and a track record of impact are highly desirable
• Interest in and knowledge of the semiconductor industry and Micron is preferred

Required skills

• Preferred: proficiency in Python, R and SQL for statistical analysis, process modeling and data analytics
• Preferred: experience with Visual Basic for automation and tool integration