Advanced Packaging Wafer Level Technology Engineer

About the role

Micron, a global leader in memory and storage solutions, is hiring an engineer for its Fab 10A site to work on advanced packaging wafer-level technology. The role covers process development, equipment and materials evaluation, quality improvement and coordination with internal and external partners to deliver technology nodes and scale to high-volume manufacturing.

Key responsibilities

• Process development: establish and improve wafer-level process conditions and technologies such as wafer thinning and backside metal interconnect, upgrade process capabilities and reduce production costs, and set up process management projects for next-node scaling.
• Equipment and materials: evaluate and promote new equipment and materials, and set process parameters for a range of semiconductor equipment.
• Quality improvement: ensure process, measurement, inspection and testing coverage, correlate defense mechanisms, run continuous data analysis and establish advanced controls.
• Collaboration: work with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering and Global Quality, and support the transition from new product development to high-volume production.
• Document Process of Record (POR) and Model of Record (MOR) for product transfer to high-volume manufacturing facilities.

Required profile

• Bachelor's or advanced degree in Engineering or Science.
• Strong analytical, logical and critical thinking skills, and effective communication across all levels.
• Growth mindset, leadership and a track record of impact are highly desirable.
• Knowledge of the semiconductor industry and Micron is preferred.
• Internship or semiconductor industry experience is a plus.

Required skills

• Preferred: Python, R and SQL for statistical analysis, process modeling and data analytics.
• Preferred: Visual Basic for automation and tool integration.