Associate Engineer - Backgrind & Dicing

About the role

The Associate Engineer supports critical wafer manufacturing processes by handling backgrind and dicing before final shipment. The role covers equipment setup, process control and defect reduction, working closely with process and equipment engineers, product and lot owners and cross-functional teams to troubleshoot issues, improve processes and maintain safety and quality compliance. It suits people with hands-on experience in assembly, backgrind or dicing.

Key responsibilities

• Support the daily run of backgrind and dicing
• Perform incoming and outgoing inspections
• Perform laminating, taping/detaping, backgrind and dicing as required by the process
• Measure thickness and enter data into SiView
• Carry out equipment preventive maintenance according to the planned schedule
• Enter SPC data for all defined equipment critical parameters
• Perform other duties as assigned, possibly supporting other lines such as diffusion, implant or wet
• Follow all environmental, health, safety and security requirements

Required profile

• Diploma or ITE Hi-Nitec (electrical, electronic or mechanical)
• At least 2 years of experience in an electronic production environment, preferably in OSAT or assembly with backgrind or dicing experience
• Able to work 12-hour rotating shifts

Required skills

• Microsoft Office literacy
• SPC knowledge