Associate Engineer (Backgrind & Dicing)

About the role

GlobalFoundries, a full-service semiconductor foundry, is hiring an Associate Engineer for its backgrind and dicing process. The role supports critical wafer manufacturing steps by processing backgrind and dicing before final shipment, focusing on equipment setup, process control and defect reduction. It suits people with hands-on experience in assembly, backgrind or dicing.

Key responsibilities

• Support the daily run of backgrind and dicing operations
• Perform incoming and outgoing inspections
• Carry out laminating, taping/detaping, backgrind and dicing as required by the process
• Measure wafer thickness and enter the data into SiView
• Carry out equipment preventive maintenance according to the planned schedule
• Enter SPC data for all defined equipment critical parameters
• Support other lines such as diffusion, implant or wet when assigned
• Follow all environmental, health, safety and security requirements

Required profile

• Diploma or ITE Hi-Nitec (electrical, electronic or mechanical)
• At least 2 years of experience in an electronic production environment, preferably in an OSAT or assembly setting with backgrind or dicing experience
• Able to work 12-hour rotating shifts

Required skills

• Microsoft Office literacy
• SPC knowledge