Global OSAT Operation Engineering

About the role

Provide technical leadership for yield, quality, reliability, and productivity improvement across OSAT sites, driving manufacturing excellence and supply resilience.

Key responsibilities

• Lead qualification planning, gap assessment, risk mitigation, Safe Launch execution, and PCN activities.
• Drive manufacturing excellence initiatives such as cycle time reduction, bottleneck elimination, equipment qualification, and process optimization.
• Manage OSAT site transfers, second‑source qualification, and capacity expansion projects.
• Partner with global Product Engineering, Quality, Reliability, Supply Chain, and Manufacturing teams for successful project execution.
• Lead supplier technical assessments, capability benchmarking, and readiness reviews for OSAT partners.
• Champion Smart Factory initiatives, including AI/ML deployment, predictive analytics, and automated defect detection.

Required profile

• Degree or MSc in Mechanical, Materials, Manufacturing, Electronics Engineering or equivalent.
• Minimum 8‑10 years of semiconductor assembly and packaging experience, preferably in OSAT management, site transfer, and qualification projects.
• Proven experience in yield improvement, quality management, and manufacturing productivity enhancement.
• Strong project management, leadership, and stakeholder management skills in a cross‑functional global environment.

Required skills

• Advanced packaging technologies: WLCSP, FOWLP, Cu Pillar Bumping, Flip‑Chip.
• Mainstream packages: QFN, LQFP, wire bond.
• Package qualification, Safe Launch execution, change management (PCN), subcontractor management.
• DOE, SPC, FDC, process control, reliability qualification, root cause analysis.
• Familiarity with AI/ML, Smart Factory, Industry 4.0, manufacturing digitalization.