HIG-HBM Product & System Engineer (Media Health Manufacturing)

About the role

Micron is looking for an experienced technical professional to join the High Bandwidth Memory (HBM) Product Engineering - Media Health team. You will drive manufacturing execution for Micron's next-generation HBM products, including DRAM die, interface die and stacked HBM solutions, with direct ownership of the core manufacturing KPIs of Quality, Cost, Cycle Time and Scale. The role works closely with Fab, Product Leads, Design Engineering, Technology Development and Test Solutions Engineering.

Key responsibilities

• Ensure optimized test coverage on current and future HIG HBM designs and process nodes
• Develop, validate, characterize and qualify next-generation HBM products, supporting design verification with CAD tools and Verilog simulations
• Improve manufacturing test yields for DRAM, interface and stacked dies, reduce test time and resolve yield-related issues
• Root cause and resolution of manufacturing test flow, qualification and RMA device issues
• Promote innovation and improvements that give Micron a technical advantage
• Develop and mentor others, and manage projects with timely delivery
• Make final decisions on risk analysis and project prioritization
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams

Required profile

• Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field
• Solid problem-solving approach focused on root cause analysis
• Strong attention to detail, commitment to quality and professional work ethic
• Team player with clear written and spoken English, especially for technical topics

Required skills

• Familiarity with CMOS technology, DRAM architecture and basic device physics
• Exposure to data analysis, statistics and scripting tools such as Python or JMP
• Coursework or internship in semiconductor devices, circuit design or product validation is a plus