HIG-HBM Product System & Engineering Engineer

About the role

Micron is looking for an engineer to join its High Bandwidth Memory (HBM) Product Engineering team in Media Health Manufacturing. You will lead a high-performing team driving manufacturing and activities for Micron's latest HBM products, on DRAM and interface dies and on stacked products, focusing on quality, cost, cycle time and scale. The role works closely with cross-functional teams such as Fab, Product Leads, Design, Technology Development and Test Solution Engineering.

Key responsibilities

• Ensure optimized test coverage on current and future HIG HBM designs and process nodes
• Develop, validate, characterize and qualify next-generation HBM products
• Support design verification of new products using CAD tools and Verilog simulations
• Improve manufacturing test yields (DRAM, interface and stacked die), reduce test time and resolve yield-related issues
• Root cause analysis and resolution of manufacturing test flow, qualification and RMA device issues
• Promote innovation and drive improvements in cost, cycle time and quality
• Mentor team members and contribute to project management and technical decision-making
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams

Required profile

• Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field
• Experience in semiconductor devices, circuit design or product validation is a plus
• Strong problem-solving approach focused on root cause analysis
• Attention to detail, teamwork, clear communication and a commitment to quality

Required skills

• Familiarity with CMOS technology, DRAM architecture and basic device physics
• Exposure to data analysis, statistics and scripting tools such as Python or JMP