MTS Module Engineer - Advanced Packaging (2.5D and 3D Heterogeneous Integration)

About the role

GlobalFoundries Singapore is looking for an experienced MTS / Principal Process Engineer to join its first 300mm Advanced Packaging Center. The role develops and optimizes unit processes for advanced packaging (bond and debond, plasma/UV/cleaning pre-bond, die re-constitution, annealing and TSV) on multi-stack bonded wafers and die-to-wafer processes, troubleshoots process and tool issues, helps start up tools and owns the processes and tools in manufacturing.

Key responsibilities

• Design, execute and analyze experiments to develop advanced packaging etch processes meeting technology and manufacturing targets such as performance, yield, reliability, process stability and cost of ownership.
• Startup and qualify new processes and new equipment within schedule, working with the Equipment Engineer on acceptance and tool matching.
• Understand repeatability and reproducibility (R&R) runs and improve process robustness for high volume manufacturing using statistical tools, DOE, data-driven decisions and lean manufacturing and Six Sigma methods.
• Work with the equipment team to improve equipment productivity indices and resolve complex technical and yield-related issues.
• Support the Integration team and Quality organization so technology meets qualification and reliability requirements, and sustain and improve process and SPC to meet quality, cost and productivity goals.
• Coach other engineers on advanced packaging etch processes, facilitate CIP programs to optimize process window, cost, yield and productivity, and plan strategies to improve process capability.
• Work safely and support Environmental, Health, Safety and Security requirements.

Required profile

• BS, MSc or PhD in Electrical Engineering, Materials Science and Engineering, Chemical Engineering, Physics or another relevant engineering discipline.
• 4+ years (PhD), 6+ years (MSc) or 8+ years (BSc) of experience in the advanced packaging industry.
• Experience leading fab-wide cross-module process development and project coordination.
• Hands-on experience with advanced packaging process tools (Si interposer, D2W, W2W).
• Excellent verbal and written communication and strong interpersonal skills, able to work with people from different cultures.