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Package Characterization Lab Manager, APTD

micron · Fab 10A

New
Senior 🇬🇧 English
SEM EDX FIB TEM AFM FTIR XPS CSAM Ion milling Delayering Decapsulation

Job description

About the role

Micron is hiring a Package Characterization Lab Manager within its Advanced Packaging Technology Development (APTD) team. You will lead a high-performing team of shift engineers and technicians who deliver package characterization and failure analysis (FA) support for leading-edge technology development in advanced packaging. The role provides technical direction, owns lab operational excellence and workforce development, and works closely with Micron's global engineering labs, subject-matter experts and external vendors.

Key responsibilities

  • Lead the Package Characterization lab to meet key performance metrics, cycle-time and safety standards.
  • Plan and optimize FA lab equipment, space and budget, and coordinate calibration, repairs and spare parts to maintain equipment uptime.
  • Evaluate and introduce new FA tool models with vendors and Micron subject-matter experts.
  • Lead EHS, quality, TS, ISO14001, OHSAS and customer audits with a safety-first culture.
  • Mentor staff, drive continuous improvement of characterization methodologies, and benchmark and standardize best-known methods across sites.
  • Ensure FA lab readiness for new product designs and technologies, and deliver actionable analysis insights to support technical and business decisions.
  • Build a training and development program including hands-on FA casework, cross-site learning and leadership mentoring, and define and track performance metrics.

Required profile

  • Bachelor's degree or higher (Master's/PhD preferred) in Materials Science, Physics, Chemistry or a related field.
  • 8+ years of experience in semiconductor package characterization (physical/thermal/chemical) and failure analysis.
  • Experience in lab management, shift resource planning and budgeting.
  • Proven technical leadership and people management capability.

Required skills

  • Knowledge of FA tools such as SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, ion milling, delayering and decapsulation.
  • Knowledge of semiconductor or advanced packaging manufacturing processes.
  • Strong written and verbal communication skills with a customer-focused approach.

Questions fréquentes

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Source : ats:workday

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Published 1 day ago

Expires 1 month from now

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micron

Fab 10A