Principal Engineer – CMP Process Engineering

About the role

GlobalFoundries is seeking an experienced CMP Process Engineer to join its new 300mm Advanced Packaging Center in Singapore. The role focuses on developing and optimizing process modules for cutting‑edge semiconductor packaging technologies.

Key responsibilities

• Create, analyze, and review technical charts to support process development.
• Develop and modify process formulations, methods, and controls to meet stringent quality standards.
• Establish Standard Operating Procedures (SOP) and conduct Failure Mode and Effects Analysis (FMEA) for assigned processes.
• Review product development requirements for compatibility with processing methods, assessing cost and schedule impacts.
• Integrate equipment and material capabilities to satisfy module and technology specifications.
• Drive Continuous Improvement Plans (CIP) to enhance process performance indices.
• Collaborate with cross‑functional teams to achieve organizational goals while ensuring safety and compliance with Environmental, Health, Safety & Security requirements.

Required profile

• Degree or Master’s in an engineering or science discipline.
• 5–7 years of experience in the electrical/electronics industry, preferably in semiconductor process engineering.