Principal Engineer – HIG HBM Product Engineering (Media Health Reliability)

About the role

Micron is looking for a Principal Engineer to lead the High Bandwidth Memory (HBM) Product Engineering Media Health team in Singapore. You will drive reliability test development, execution, and continuous improvement for Micron’s latest HBM products, covering both DRAM and interface dies.

Key responsibilities

• Define and develop reliability stress test flows and plans for HBM products.
• Collaborate with Global Quality to manage qualification plans, track execution, and resolve gating issues.
• Reduce extrinsic and intrinsic DPM through optimized manufacturing test strategies.
• Perform root‑cause analysis of qualification and RMA failures using Electric Failure Analysis (EFA) and Physical Failure Analysis (PFA).
• Recommend and support new fab process conversions to improve yield, cost, and reliability.
• Communicate risk and progress with product managers and cross‑functional teams.

Required profile

• Strong background in semiconductor reliability engineering, preferably with DRAM or HBM experience.
• Proven ability to lead technical teams and drive cross‑functional projects.
• Excellent analytical skills for failure analysis and process improvement.
• Effective communication with fab, test development, and quality teams.

Required skills

• Electric Failure Analysis (EFA)
• Physical Failure Analysis (PFA)
• Reliability test flow development
• Manufacturing test flow optimization
• Knowledge of DRAM and High Bandwidth Memory (HBM) technologies