Principal Signal Integrity Engineer - R&D Networking Platforms

About the role

Hewlett Packard Enterprise (HPE) Networking is seeking a Principal Signal Integrity Engineer to provide technical leadership for signal and power integrity across multiple networking platforms and future technology generations. The role is onsite, with the expectation of working primarily from an HPE office in Singapore. As a recognized subject matter expert, you will influence architecture, design methodologies, engineering standards and technology roadmaps.

Key responsibilities

• Define and drive the SI/PI technical strategy, methodologies, design standards and engineering best practices across networking hardware platforms.
• Lead signal and power integrity architecture for next-generation networking systems, from concept through production.
• Provide technical leadership for high-speed interfaces, including next-generation SerDes technologies at leading-edge data rates.
• Establish company-wide SI/PI design guidelines, PCB stackup strategies, routing methodologies and validation approaches.
• Lead cross-functional technical reviews and resolve complex SI/PI challenges across products and disciplines.
• Develop simulation methodologies, modelling approaches and automation techniques to improve engineering productivity.
• Drive SI/PI technology readiness for future products and evaluate emerging technologies and materials.
• Lead root-cause investigations of field, validation and manufacturing issues involving signal integrity, power integrity, timing and electromagnetic interactions.
• Partner with ASIC, package, PCB, mechanical, thermal and system architects to optimize electrical performance.
• Promote innovation through patents, industry engagement and publications, and mentor engineers across multiple sites.
• Serve as the final escalation point for critical SI/PI technical decisions, balancing performance, risk, schedule and product cost.

Required profile

• Bachelor's, Master's or PhD in Electrical Engineering, Computer Engineering or a related field.
• 15+ years of experience in signal integrity, power integrity, package design, PCB design and high-speed system architecture.
• Recognized expert in high-speed digital system design, with deep understanding of electromagnetic theory, transmission lines, crosstalk, loss, jitter, equalization and channel optimization.
• Demonstrated success leading SI/PI strategies across multiple large-scale product developments.
• Preferred: technical leadership across geographically distributed teams, mentoring experience, patents or publications, and strong communication skills.

Required skills

• SI/PI simulation: time-domain, frequency-domain, statistical, BER and electromagnetic analysis.
• Tools: Synopsys HSPICE, Keysight ADS, Ansys HFSS, SIwave, PowerSI and Cadence design environments.
• PCB stackups, routing architectures, power distribution networks and signal integrity requirements for high-volume products.
• Laboratory instrumentation: VNAs, TDRs, high-bandwidth oscilloscopes, spectrum analyzers and compliance test equipment.