Principal/Staff/Senior Engineer, Package Characterization (APTD)

About the role

Micron is hiring a Principal/Staff/Senior Engineer for its Advanced Packaging Technology Development (APTD) team. The engineer provides package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introductions and general test failures, acting as the domain expert on advanced packaging characterization methodology.

Key responsibilities

• Electrical and PFA characterization: perform electrical fault analysis to pinpoint hotspots, precision cross-sections with Plasma FIB, and die-stacked characterization; understand PFA techniques for de-processing failures and establish best-known methods.
• Data analysis: understand backend test flows and qualification methodologies, document failure analysis techniques, and give quick, responsive feedback on PFA results to Product, Process Integration, Reliability, Assembly, RMA and QRA.
• Technical expertise: train and certify staff, act as technical SME and mentor, share knowledge at conferences and workshops, and engage vendors on FA tools.
• Laboratory management: uphold safety standards, manage the lab to comply with TS, ISO14001 and OHSAS requirements, run the exhaust and scrubber systems, and keep records per Micron GOPs.
• Maintain equipment: coordinate external calibrations, procure parts and coordinate host vendors for repairs.

Required profile

• PhD with at least 5 years, or Master's with at least 7 years, or Bachelor's with at least 10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field.
• Semiconductor industry experience on complex products, preferably in product, packaging or test engineering.
• At least 4 years of experience in the semiconductor process, preferably in R&D, technology development or failure analysis.
• Strong analytical and problem-solving skills, and ability to work independently, collaboratively and cross-functionally in a fast-paced environment.

Required skills

• Failure analysis methodologies and techniques.
• SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, ion milling, delayering and decapsulation.
• Ability to use AI-enabled tools responsibly and effectively.