Process Engineer Intern - Semiconductor Packaging

About the role

Applied Materials, a global leader in materials science and engineering solutions for semiconductors and advanced displays, is hiring a Process Engineer Intern in Singapore. The intern supports the development, characterization and optimization of thin film deposition processes for advanced semiconductor packaging, working closely with process, hardware and materials engineers to run experiments, analyze data and contribute to new technology.

Key responsibilities

• Assist engineers in designing and running process experiments, and optimize CVD, PECVD, PEALD or related thin film deposition processes
• Perform wafer processing runs and analyze results to find performance improvements
• Collect and analyze process and metrology data, characterizing film thickness, uniformity, refractive index, stress, composition, surface roughness and electrical properties
• Use statistical methods and data visualization to find trends, and run film characterization and integration tests on an internal test vehicle
• Support troubleshooting and root cause analysis, document findings and propose corrective actions
• Maintain experimental records and engineering logs, prepare technical reports and present results to engineering leadership
• Collaborate with Process, Hardware, Manufacturing and Product Engineering teams, and support customer-focused development

Required profile

• Preferred: knowledge of semiconductor manufacturing processes
• Preferred: basic understanding of thin film deposition, plasma processing or surface science
• Preferred: experience with experimental design and data analysis
• Strong problem-solving and analytical skills, effective written and verbal communication, and ability to work independently and in a team

What we offer

• Hands-on exposure to semiconductor manufacturing equipment, process development, statistical data analysis and advanced packaging technologies
• A supportive work culture focused on learning and career growth