Process Engineer, Lithography (Semiconductor)

About the role

GlobalFoundries is looking for a Lithography Process Engineer to sustain, optimize and develop photolithography processes in a high-volume manufacturing environment. The engineer works with advanced lithography tools and metrology systems to ensure critical dimension (CD) control, overlay accuracy and defect reduction.

Key responsibilities

• Monitor and analyze SPC/ESPC charts for lithography modules using SPACE and respond to OOC/OOS events.
• Perform CD and overlay analysis using CD-SEM, scatterometry and overlay metrology tools (e.g. KLA, ASML YieldStar).
• Optimize photoresist coating, soft bake, exposure, post-exposure bake and development processes.
• Tune stepper/scanner exposure tools (ASML, Nikon) and manage reticle management, focus/exposure control and alignment strategies.
• Run DOE and split lot analysis using JMP, Klarity ACE and other statistical tools.
• Troubleshoot defects such as bridging, footing, scumming and resist residues.
• Collaborate with equipment engineers on tool qualification, FEM and process window optimization.
• Drive process improvements for CD uniformity, overlay, LER and CDU, support NPI and ramp-up, and lead CAPA for yield excursions.
• Maintain compliance with TS16949 and other quality standards through audits and documentation.

Required profile

• Bachelor's degree in electrical, electronics, mechanical, mechatronics or microelectronics engineering.
• 1 to 3 years of experience in semiconductor wafer process engineering.
• Proven ability to identify, assess and solve problems.
• Willingness to work normal or swing shifts (or 12-hour rotating shifts if required).
• Preferred: prior foundry or similar industry experience.

Required skills

• SPACE, JMP, Klarity ACE
• CD-SEM, scatterometry, overlay metrology
• TS16949 quality standards