Process Engineer – Wafer Bumping, Singulation, Grinding & Mounting

About the role

We are looking for a motivated Process Engineer to support backend semiconductor packaging operations, focusing on wafer bumping, singulation, grinding and mounting. The role involves day‑to‑day engineering support to meet production output, quality, yield and safety targets in a fast‑paced manufacturing environment.

Key responsibilities

• Provide engineering support for wafer bumping, singulation, grinding/backgrind and mounting processes.
• Monitor and analyse process data to identify trends, risks and improvement opportunities.
• Lead troubleshooting for process abnormalities, yield loss and quality excursions.
• Drive corrective and preventive actions to resolve chronic issues.
• Evaluate new products, materials and processes during pilot runs and ensure readiness for production release.
• Maintain work instructions, control plans, FMEA and process control documents.
• Prepare documentation for internal and external audits and support audit follow‑up actions.
• Identify and implement improvement actions using SPC, MSA and structured problem‑solving methods.

Required profile

• Bachelor’s degree in Mechanical, Materials, Chemical, Manufacturing Engineering or related field.
• Preferably at least 2 years of experience as a Process Engineer in semiconductor assembly or backend manufacturing; fresh graduates with strong technical aptitude may also be considered.
• Strong data analysis, problem‑solving and critical‑thinking abilities.
• Ability to work collaboratively with production, equipment, quality, planning and cross‑functional teams.

Required skills

• Wafer bumping
• Wafer singulation
• Wafer grinding/backgrind
• Wafer mounting
• Statistical Process Control (SPC)
• Measurement System Analysis (MSA)
• Failure Mode and Effects Analysis (FMEA)
• Data analysis