Product Engineering Engineer, HBM Manufacturing

About the role

Micron is looking for an experienced Product Engineering engineer for its High Bandwidth Memory (HBM) team in Fab 10A. The role drives manufacturing execution for next-generation HBM products, including DRAM die, interface die and stacked HBM solutions, with direct ownership of the core manufacturing KPIs of Quality, Cost, Cycle Time and Scale. It works closely with Fab, Product Leads, Design Engineering, Technology Development and Test Solutions Engineering.

Key responsibilities

• Ensure optimized test coverage on current and future HIG HBM designs and process nodes
• Develop, validate, characterize and qualify next-generation HBM products
• Support design verification of new products using CAD tools and Verilog simulations
• Improve manufacturing test yields for DRAM, interface and stacked dies, reduce test time and resolve yield issues
• Root cause and resolution of manufacturing test flow, qualification and RMA device issues
• Promote innovation and improvements that give Micron a technical advantage
• Develop and mentor others, and manage projects with timely delivery
• Make final decisions on risk analysis and project prioritization
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams
• Leverage AI-powered tools and automation to improve productivity and efficiency

Required profile

• Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field
• Experience in semiconductor devices, circuit design or product validation
• Strong problem-solving approach focused on root cause analysis
• Attention to detail, teamwork, flexibility and clear written and spoken English

Required skills

• CMOS technology, DRAM architecture and basic device physics
• Data analysis, statistics and scripting tools such as Python or JMP