Product Engineering Engineer - Heterogeneous Integration, High Bandwidth Memory

About the role

Micron is hiring an Engineer for Product Engineering in the Media Health Reliability area, focused on heterogeneous integration of High Bandwidth Memory (HBM). The role works with the Global Quality team on reliability qualification, drives down device failure rates, supports process conversions and collaborates with fab, design and system teams.

Key responsibilities

• Define and develop reliability stress test flows, test plans and qualification plans, working with the Global Quality team and managing qualification execution and gating issues.
• Reduce extrinsic (time 0 and field) and intrinsic reliability through optimized manufacturing test flows and strategies, meeting quality, cost and cycle time KPIs.
• Debug and resolve root causes of qualification and RMA device defects using electric failure analysis (EFA) and physical failure analysis (PFA).
• Advise fab teams on process conversions that improve yield, quality and reliability of HBM products, and manage the associated risks with Product Managers.
• Promote innovation and technical advantages, mentor team members, and support project management and technical decision-making.
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams.
• Integrate AI and automation into reliability workflows as part of Micron's AI-first approach.

Required profile

• Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field.
• Experience in semiconductor devices, circuit design or product validation is a plus.
• Strong problem-solving ability, attention to detail, teamwork, clear communication and a commitment to quality.

Required skills

• Familiarity with CMOS technology, DRAM architecture and basic device physics.
• Exposure to data analysis, statistics and scripting tools such as Python or JMP.