R&D Process Engineer (Hybrid Bonding)

About the role

Applied Materials, a global leader in materials science and engineering solutions for semiconductors and displays, is hiring an R&D Process Engineer (Hybrid Bonding) in Singapore. The engineer designs and optimizes manufacturing processes for display and semiconductor technologies, collects and analyzes data, performs hardware characterization, troubleshoots engineering issues, measures film properties, generates technical documentation and works with vendors and suppliers. The role is full-time, regular and involves local and regional travel.

Key responsibilities

• Collect data, analyze it and compile reports on basic process engineering experiments
• Perform hardware characterization on basic systems
• Troubleshoot problems, perform root cause analysis and resolve basic process engineering issues
• Measure film properties and organize data and reports for review
• Generate internal documentation for products, presentations and technical reports
• Engage with customers to resolve basic process engineering issues, under direct supervision
• Work with vendors and suppliers, under direct supervision
• Become familiar with implementing new technology, products and analytical instrumentation

Required profile

• PhD or Master's degree in Materials Science, Chemical Engineering, Chemistry, Physics or a related field
• More than 3 years of semiconductor process development experience in Hybrid Bonding or other modules
• Research focus in the semiconductor field is an added advantage
• Good communication and interpersonal skills, problem-solving attitude and a quality mindset
• Willingness to travel locally and regionally as required