Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology

About the role

Micron's Advanced Packaging Technology Development (APTD) delivers package development for high-performance memory products and transfers them to manufacturing. As a Senior Engineer in the APTD CEM team, you will develop and enable deployment of assembly processes for advanced packaging technologies such as wafer-level packaging and die stacking, meeting performance, cost, manufacturability, quality, reliability and schedule requirements. The role also includes integrating AI-assisted tools into daily work.

Key responsibilities

• Develop and optimize assembly processes for advanced packaging, including wafer-level packaging and die stacking (Chip on Wafer, Chip to Wafer), improving quality, yield, productivity and reducing costs
• Establish and improve process management projects to deliver technology node requirements
• Evaluate and promote new equipment and materials, and set up process parameters for semiconductor equipment
• Ensure process defense coverage through measurement, inspection and testing, and use data analysis to set advanced controls
• Work with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering and Global Quality to integrate manufacturing processes
• Support the transition from new product development and qualification to high-volume production, and provide Process of Record and Model of Record documentation for product transfer
• Use AI tools responsibly to improve efficiency, quality and effectiveness, and share AI-enabled improvements

Required profile

• PhD or Master's degree with at least 3 years, or Bachelor's degree with at least 5 years, of experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field
• Semiconductor process development or equipment evaluation experience, preferably in wafer bonding, die stacking and packaging
• Strong analytical and problem-solving skills, and strong communication, leadership and stakeholder management skills
• Ability to work independently and collaboratively in a fast-paced, cross-functional environment
• Baseline digital fluency and role-appropriate AI literacy

Required skills

• Proficiency in Python, R and SQL for statistical analysis, process modeling and data analytics
• Experience with Visual Basic for automation and tool integration
• Familiarity with E3, FDC (Fault Detection and Classification) and RMS (Recipe Management System)
• Strong data analytics for SPC, DOE, defect analysis and dashboarding