Senior Engineer, APTD CEM - Advanced Packaging Integration

About the role

Micron's Advanced Packaging Technology Development (APTD) team develops package development for high-performance memory products and transfers them to manufacturing. It is looking for a Senior Engineer (Advanced Packaging Integration) to help deliver advanced packaging technologies that meet performance, cost, manufacturability, quality, reliability and schedule requirements, and to identify and propose yield-related breakthroughs.

Key responsibilities

• Develop and enable advanced package technology for post-fab wafer finish and assembly processes, improving quality, yield, productivity and reducing costs.
• Integrate semiconductors while working with process and product engineering teams.
• Improve yields through silicon package integration, including layout/design and process margin improvements, and analyse data to recommend changes.
• Work with Probe, Yield Analysis, Test and Product Engineering teams.
• Ensure process, measurement, inspection and test coverage, establish correlations between defense mechanisms and run continuous data analysis for advanced controls.
• Build technology development strategies with internal and external stakeholders, and ensure a smooth transition from NPD, qualification and small-volume production to high-volume production.
• Provide Process of Record (POR) and Model of Record (MOR) documentation for transfer to high-volume manufacturing.
• Use AI-assisted tools responsibly and share AI-enabled improvements within your scope.

Required profile

• PhD or Master's degree with at least 3 years, or Bachelor's degree with at least 5 years, of experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field.
• Semiconductor process integration experience, preferably in developing advanced package technology for post-fab wafer finish and assembly.
• Strong analytical and problem-solving skills, and strong communication, leadership and stakeholder management skills.
• Ability to work independently and cross-functionally in a fast-paced environment.
• Baseline digital fluency and role-appropriate AI literacy.

Required skills

• Python, R and SQL for statistical analysis, process modeling and data analytics.
• Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification) and RMS (Recipe Management System).
• Data analytics for SPC, DOE, defect analysis and dashboarding.