Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology

About the role

Micron's Advanced Packaging Technology Development (APTD) delivers package development for high-performance memory products and transfers them to manufacturing. This Senior Engineer role covers post-fab wafer finishing processes in semiconductor manufacturing, meeting performance, cost, manufacturability, quality, reliability and schedule requirements. The position involves global collaboration across Singapore, Boise and Taiwan sites.

Key responsibilities

• Develop and enable deployment of post-fab wafer finishing processes such as photolithography, dry etch, CMP, wet process, deposition, plating, wafer bonding and wafer thinning
• Manage experiments to widen process margins and test manufacturability of next-node solutions, and lead quality, yield, cost and productivity improvement meetings
• Evaluate new equipment and materials, quantify their benefits and promote early adoption
• Ensure process, measurement, inspection and testing coverage, establish correlations between defense mechanisms and run continuous data analysis for advanced controls
• Integrate and troubleshoot processes with cross-functional teams, ensure smooth transition from NPD and qualification to high-volume production, and provide Process and Model of Record documentation
• Use AI-assisted tools to improve efficiency, quality and effectiveness, and share AI-enabled improvements

Required profile

• PhD, or Master's degree with at least 3 years, or Bachelor's degree with at least 5 years of experience in electrical, materials, chemical or physics engineering
• Semiconductor process development experience, preferably in wafer bonding, plating, warpage control and packaging
• Deep understanding of chemistry, chemical kinetics, thermodynamics, mass transport and film/interface engineering (SIMS, XPS, EDX, SEM/TEM)
• Ability to collaborate with local and overseas teams, communicate clearly and adapt to extended hours when needed
• Ability to work independently and collaboratively in a fast-paced, demanding environment

Required skills

• Python, R and SQL for statistical analysis, process modeling and data analytics
• Visual Basic for automation and tool integration
• Familiarity with E3, FDC and RMS for equipment and process control
• SPC, DOE, defect analysis and dashboarding
• Understanding of process flows and how process changes affect yield, performance and reliability
• AI literacy and digital fluency