Senior Engineer, HBM Reliability & Process Conversion

About the role

Micron is looking for an Engineer or Senior Engineer in its High Bandwidth Memory (HBM) Product & System Engineering team, based at Fab 10A. The role drives extrinsic DPM reduction (Time 0 and Field DPM) and leads the intrinsic reliability charter, working with a high-performing team on reliability test development and execution for HBM products on DRAM and interface dies and stacked products.

Key responsibilities

• Define and develop reliability stress, test flows and test plans covering all product reliability aspects.
• Work with the Global Quality team to define the qualification plan, manage qualification execution and drive resolution of gating issues.
• Reduce extrinsic reliability (Time 0 and Field DPM) and intrinsic reliability through optimized manufacturing test flows and test strategy, meeting quality, cost and cycle time KPIs.
• Debug and resolve qual and RMA device issues via electric failure analysis (EFA) and physical failure analysis (PFA).
• Advise fab teams on process conversions to reduce cost and increase yield, and communicate with Product Managers to manage conversion risks.
• Promote innovation and technical advantages, manage project priorities and deliver projects on time.
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams.
• Use AI-assisted tools to improve efficiency and share AI-enabled improvements.

Required profile

• Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field.
• Coursework or internship in semiconductor devices, circuit design or product validation is a plus.
• Clear written and spoken communication, especially of technical concepts.

Required skills

• Solid understanding of problem-solving and root cause analysis.
• Familiarity with CMOS technology, DRAM architecture and basic device physics.
• Exposure to data analysis, statistics and scripting tools such as Python or JMP.