Senior FEA Modeling Engineer - Advanced Packaging

About the role

Applied Materials is seeking an experienced Senior FEA Modeling Engineer to join its Advanced Packaging Modeling team in Singapore. The engineer will independently lead complex thermal-mechanical simulation projects that influence package architecture, material selection, process windows, qualification strategy and reliability risk reduction. The role requires about five or more years of relevant industrial experience and strong technical judgment.

Key responsibilities

• Independently define, develop, validate and deploy high-fidelity FEA models for advanced semiconductor package technologies.
• Lead thermo-mechanical reliability modeling to predict package performance and failure risks under manufacturing, qualification and operating conditions, including thermal cycling, process-induced stress, fatigue, creep, delamination and interfacial failure.
• Run thermal-mechanical analyses of stress, strain, warpage, creep, plasticity and viscoelasticity across flip-chip, fan-out, 2.5D/3D IC, chiplet, TSV, HBM and hybrid-bonded structures.
• Develop thermal and coupled multi-physics models to guide package design, material tradeoffs, process integration and cooling concepts.
• Translate business and engineering questions into simulation requirements, model hierarchies, validation plans and decision-ready outputs.
• Plan and run sensitivity analyses, design-of-experiment studies, optimization and uncertainty assessments.
• Correlate models with metrology, material characterization, reliability testing and failure analysis, and calibrate constitutive models.
• Mentor junior engineers, set modeling best practices and drive automation, standardization and reuse.
• Support technology roadmaps and evaluate emerging materials, interconnects, processes and package architectures.

Required profile

• M.S. or Ph.D. in Mechanical Engineering, Materials Science, Applied Mechanics, Applied Physics or a related field.
• At least five years of industrial experience in thermal-mechanical FEA, preferably in semiconductor packaging or an adjacent high-reliability domain.
• Strong knowledge of advanced packaging architectures and processes such as die attach, underfill, molding, bumping, bonding, reflow and wafer-level processes.
• Proven ability to validate models, diagnose numerical and physical issues and communicate recommendations to technical and leadership audiences.
• Ability to manage multiple priorities across design, process integration, reliability, manufacturing and external partners.

Required skills

• Proficiency with ANSYS, Abaqus, COMSOL or an equivalent commercial FEA platform, including nonlinear and temperature-dependent material modeling.
• Practical understanding of polymers, metals, ceramics and interfaces under thermal and mechanical loading.
• Preferred: coupled electro-thermal-mechanical, fracture, cohesive-zone, creep, viscoelastic, submodeling methods; HBM, hybrid bonding, FOWLP, chiplets, co-packaged optics.
• Preferred: familiarity with JEDEC qualification methods; Python, MATLAB, APDL, TCL or similar scripting; optimization, surrogate modeling, uncertainty quantification.