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Senior Front End Engineer - Central Process Integration Engineering (CPIE)

micron · Fab 10A

New
Senior 🇬🇧 English
Microsoft Office Microsoft Copilot DRAM BEOL integration Advanced packaging

Job description

About the role

Micron Technology, Inc. is hiring a Senior Front End (FE) Engineer for its Central Process Integration Engineering (CPIE) team. You will work with the global Micron network to drive each silicon node's packaging product yield, quality improvement and new product introduction through technical expertise, business process management and project execution. You will also integrate solutions by connecting cross-functional expertise, standardizing business processes and benchmarking internal and external intelligence, using AI-enabled engineering approaches, advanced analytics and digital tools.

Key responsibilities

  • Promote worldwide synergy and efficiency gains through global project management, network benchmark knowledge sharing and business process creation and re-engineering.
  • Define strategies so that Packaging Technology and the Front End manufacturing process are fully developed and qualified before the product itself.
  • Lead the PI Loop task force or team to address yield and quality challenges and optimize process flow to achieve BIC yield performance.
  • Maintain domain knowledge and technical expertise, and keep strong relationships with peers and managers in Fab, TD, Product Engineering and GQ.
  • Present project updates and new initiative proposals to small and large groups, and follow up with your manager to meet goals and remove obstacles.
  • Travel to Micron Fab locations as needed, and drive AI and digital transformation initiatives with AI tools, data analytics and automation.

Required profile

  • Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science Engineering or a related field.
  • 5 years of relevant experience in semiconductor device physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.
  • 3 years of relevant experience in DRAM High Performance Memory (HPM), BEOL integration, advanced packaging and layout.
  • Willingness to travel 20-50% of the time.

Required skills

  • Data analysis, troubleshooting, problem solving, reporting and presentation skills.
  • Good verbal and written communication, teamwork and organizational skills.
  • Intermediate to advanced proficiency in Microsoft Office, AI-enabled productivity tools (e.g. Microsoft Copilot) and digital collaboration platforms.

Questions fréquentes

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Source : ats:workday

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Published 1 day ago

Expires 1 month from now

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micron

Fab 10A