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Senior HBM Electrical Failure Analysis (EFA) Engineer

micron · Fab 10A

New
Senior 🇬🇧 English
DRAM Failure Analysis uMate CAD layout Unix DFII/Cadence AI tools

Job description

About the role

Micron is hiring a Global Quality (GQ) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer on its DRAM/Emerging Memory Quality and Reliability Assurance team (DEMQRA). The engineer characterizes and analyzes electrical failures of HBM products, distinguishing package-related from device-related failures, and communicates with engineering groups to drive yield and reliability.

Key responsibilities

  • Analyze failed components from reliability testing, interpret historical test results and adjust timing, levels, test mode, code and temperature to find failure sensitivities
  • Perform visual inspection, use schematics, layouts and process data to document and categorize electrical failures
  • Coordinate next-level analysis with PYE, Product Engineering and Package Reliability, and report new or unusual electrical signals
  • Respond to equipment issues: troubleshoot hardware, configure and upgrade test equipment, and develop and deploy FA software
  • Provide technical support and training to lab users, including on-the-job training for new hires
  • Handle engineering requests and supplemental tasks such as package-level PFA, test requirement execution and repair converters
  • Create and maintain the FA database, track FA data, identify false failures and summarize data
  • Review quality/reliability requests, design/datasheet requests, modify qualification requests, MRB, PORRB and customer reports

Required profile

  • Bachelor's degree in Electrical, Electronics or Computer Engineering; a Master's degree is desired
  • 5+ years of experience in the semiconductor field
  • Knowledge of DRAM operation, fabrication process and semiconductor device physics
  • Familiarity with failure analysis, troubleshooting, advanced packaging, wafer testing, component testing and module testing
  • Strong troubleshooting, organizational and communication skills, and ability to work independently or in a group

Required skills

  • DRAM fabrication process, test program and device knowledge
  • Preferred familiarity with Unix, DFII/Cadence and uMate
  • Ability to use analytical tools on test equipment such as uMate, curve tracer and oscilloscope
  • Proficiency applying AI and AI-enabled tools to improve engineering workflows

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Source : ats:workday

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Published 23 hours ago

Expires 1 month from now

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micron

Fab 10A