Senior Principal Engineer, Mechanical Engineering, Advanced Packaging

About the role

ASM is looking for a Senior Principal Engineer to join its Advanced Packaging team in Singapore. You will work at the intersection of cutting‑edge semiconductor technology, mechanical engineering, and field operations, driving reliable performance from concept through high‑volume manufacturing.

Key responsibilities

• Design and develop mechanical systems for next‑generation semiconductor equipment, including equipment selection and automation integration.
• Manage project timelines, budgets and resources while ensuring compliance with safety and quality standards.
• Collaborate with cross‑functional teams in manufacturing, operations and quality to align goals and deliverables.
• Provide technical support, troubleshooting and root‑cause analysis for equipment and automation systems.
• Own BOM release and maintenance, delivering accurate documentation and reporting to stakeholders.
• Drive continuous‑improvement initiatives and stay current with industry advancements.

Required profile

• Extensive experience in mechanical engineering within the semiconductor or advanced packaging sector.
• Proven ability to lead complex projects from development through customer qualification and scale.
• Strong analytical and problem‑solving skills with a focus on performance improvement.
• Excellent communication and teamwork abilities to work across global functions.

Required skills

• Mechanical systems design
• Automation integration
• Process controls
• Equipment troubleshooting

What we offer

• Competitive monthly salary (SGD 12,000‑20,000)
• Permanent employment with a global technology leader
• Opportunities for professional growth and mentorship
• Inclusive and diverse workplace culture