Senior Principal Foundry Engineer – HV/BCD Process Integration

About the role

The APAC Central Competence Team partners with external foundries to ensure stable chip supply for NXP business lines. This senior role drives product ramp‑up for new technology introductions and oversees foundry process transfers and fab enablement.

Key responsibilities

• Collaborate with foundries, NXP technology groups, business lines and stakeholders to qualify and release processes.
• Own front‑end process safe launch, work closely with foundries during ramp‑up to improve manufacturability and yield.
• Interface with key customers on critical projects and steer them to timely completion.
• Make decisions on process integration, balancing technical judgement, resource planning, schedule, logistics and supplier relationships.
• Lead NTI process transfers within foundries and NXP joint ventures.

Required profile

• Bachelor’s or MSc in physics or electrical engineering.
• 10+ years of front‑end IC process integration experience in foundry production or development.
• Deep knowledge of HV/BCD devices and processes.
• Strong understanding of yield enhancement techniques and data analysis.
• Fluent in spoken Mandarin and English for regular interaction with Mandarin‑speaking suppliers.
• Proven leadership in development/transfer projects or production ramp‑up.

Required skills

• Front‑end IC process integration
• HV/BCD process expertise
• Yield enhancement techniques
• Data analysis