Senior/Principal Engineer, FE OCT CPEE Photo Metrology

About the role

Micron is hiring a Senior or Principal Engineer for its FE OCT CPEE photo metrology team. The role leads HVM photo metrology (especially overlay metrology) yield, quality, productivity and cost improvement initiatives, acts as the technical authority for complex photo metrology issues across fabs, drives supplier roadmaps and engagement, and represents Micron in technical reviews, workshops and governance forums.

Key responsibilities

• Lead HVM photo/overlay metrology yield, quality, productivity and cost improvement initiatives.
• Resolve complex photo/overlay metrology issues through data-driven root-cause analysis.
• Define and deploy photo/overlay metrology Best Known Methods (BKM) across fabs for HVM and NPI.
• Act as the technical point for cross-fab, complex photo/overlay metrology customer concerns.
• Drive MOR-POR gap closure and cross-fab/node alignment with internal teams and suppliers.
• Influence key suppliers and represent Micron in reviews, workshops and governance forums.

Required profile

• BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering or a related field.
• 5+ years (Senior) or 8+ years (Principal) of experience in semiconductor photolithography in NPI/HVM manufacturing.
• Proven experience solving overlay, CDU, metrology, reticle correction, MMM, destack and yield-matching challenges.
• Experience defining and deploying Best Known Methods (BKM) across tools, nodes or fabs.
• Ability to act as a technical escalation point and lead problem solving across multiple functions.
• Comfortable working with global teams and suppliers, flexible to business travel and overseas assignment.