SMTS FE OCT CPEE Equipment Roadmap Leader

About the role

Micron is looking for an experienced technical leader to accelerate equipment and hardware differentiation, strengthen supplier collaborations and drive long-term manufacturing capability development across its global Front-End network. The role sits as a senior individual contributor within the CPEE organization, working across Process Engineering, Technology Development, Manufacturing, Procurement and external equipment and material suppliers. It combines deep semiconductor process and equipment knowledge with strong leadership, influence and execution skills.

Key responsibilities

• Identify, evaluate and deploy differentiated equipment and hardware innovations for high-volume manufacturing readiness, and develop and spread AI and equipment automation.
• Collaborate with strategic suppliers to shape future equipment architecture, subsystem design and technology roadmaps, and improve equipment capability, reliability, throughput, yield, sustainability and cost.
• Develop and maintain multi-year manufacturing capability roadmaps aligned with technology and business objectives, bridge Technology Development and High Volume Manufacturing, and close capability gaps for future nodes.
• Serve as a senior technical interface with key equipment and material suppliers, benchmark industry technologies and coordinate cross-functional supplier initiatives.
• Provide technical direction across process and equipment domains, mentor engineers and emerging leaders, and promote systematic problem solving.

Required profile

• PhD with 8+ years, MS with 12+ years, or BS with 15+ years of semiconductor industry experience.
• Demonstrated experience in semiconductor process development, equipment development, integration, advanced manufacturing or technology commercialization.
• Track record of leading complex technical programs across multiple organizations and stakeholders.
• Preferred: extensive experience in both technology development and high-volume manufacturing, and experience with equipment suppliers and industry partners.

Required skills

• Strong understanding of front-end semiconductor manufacturing and process/equipment interaction.
• Excellent communication and influence skills, able to work in a global, highly matrixed environment.
• Preferred: experience in key unit processes, advanced memory technologies, equipment architecture, advanced packaging, manufacturing roadmaps, productivity and cost optimization, and recognized technical leadership such as patents or publications.