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SMTS Process Module Engineer - Advanced Packaging (2.5D/3D Heterogeneous Integration)

globalfoundries · Singapore

New
Senior 🇬🇧 English
DOE Six Sigma SPC Lean manufacturing

Job description

About the role

GlobalFoundries Singapore is looking for a Senior Member of Technical Staff (SMTS) in Process Engineering to join its new 300mm Advanced Packaging Center. The engineer develops, optimizes and qualifies advanced packaging processes such as Bond/Debond, Plasma, UV, Cleaning, Die Reconstitution, Annealing and TSV, for multi-stack wafer bonding and die-to-wafer integration at wafer and frame-form-carrier levels. The role drives process development, troubleshoots process and equipment issues, supports tool installation and qualification, and leads the transfer of manufacturing-ready processes into production.

Key responsibilities

  • Design, execute and analyze experiments to develop advanced packaging etch processes meeting technology and manufacturing targets
  • Startup and qualify new processes and new equipment on schedule, working with the Equipment Engineer on acceptance and tool matching
  • Improve process robustness for high volume manufacturing using statistical tools, DOE, data-driven decisions, lean manufacturing and Six Sigma
  • Work with the equipment team to improve equipment productivity indices and resolve complex technical and yield issues
  • Support the Integration team and Quality organization to meet qualification and reliability requirements, and sustain and improve process and SPC
  • Coach other engineers on advanced packaging etch processes, facilitate CIP programs and plan strategies to optimize process capability
  • Work safely and support Environmental, Health, Safety and Security requirements

Required profile

  • BS, Master's or PhD in Electrical Engineering, Materials Science and Engineering, Chemical Engineering, Physics or another relevant engineering discipline
  • 7 years of relevant advanced packaging process experience
  • Experience leading fab-wide cross-module process development projects
  • Experience with advanced packaging process tools (Si interposer, D2W, W2W)
  • Excellent verbal and written communication and strong interpersonal skills across cultures

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Source : ats:workday

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Published 10 hours ago

Expires 1 month from now

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globalfoundries

Singapore